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march 2008 rev 1 1/19 19 LIS302SG mems motion sensor 3-axis - 2g analog output "piccolo" accelerometer features single voltage supply operation ~2 mw power consumption 2 g full-scale 3 acceleration channels plus multiplexed analog output ratiometric output voltage power-down mode embedded self-test 10000 g high sh ock survivability ecopack ? rohs and ?green? compliant (see section 6 ) description the LIS302SG is a miniaturized low-power three- axis linear accelerometer belonging to the ?piccolo? family of st motion sensors. it includes a sensing element and an ic interface to provide an analog signal to the external world. the sensing element, capable of detecting the acceleration, is manufactured using a dedicated process developed by st to produce motion sensors and actuators in silicon. the ic interface is manufactured using a cmos process that allows to design a dedicated circuit which is trimmed to better match the sensing element characteristics. the LIS302SG has a full scale of 2 g and it is capable of measuring accelerations over a maximum bandwidth of 2.0 khz. the device bandwidth may be reduced by using external capacitances. the self-tes t capability allows the user to check the functioning of the sensor in the final application. the device has three analog acceleration output plus an embedded multiplexer that allows to redirect the analog outputs onto a single pin for operation with a single channel a/d converter. the LIS302SG is available in plastic thin land grid array package (tlga) and it is guaranteed to operate over an extended temperature range from -40 c to +85 c. the LIS302SG belongs to a family of products suitable for a variety of applications, including: ? mobile terminals ? gaming and virtual reality input devices ? free-fall detection for data protection ? antitheft systems and inertial navigation ? appliance and robotics. lga-14 (3x5x0.9mm) table 1. device summary order codes temperature range [c] package packing LIS302SG -40 to +85 lga-14 tray LIS302SGtr -40 to +85 lga-14 tape and reel (16mm, pitch 8mm) www.st.com
contents LIS302SG 2/19 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1 sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2 ic interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3 factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 typical performance characteristi cs . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 mechanical characteristics at 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.2 mechanical characteristics derived from measurement in the -40 c to +85 c temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.3 electro-mechanical characteristics at 25 c . . . . . . . . . . . . . . . . . . . . . . . 17 6 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
LIS302SG list of figures 3/19 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. LIS302SG electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 4. output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 5. x axis zero-g level at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 6. x axis sensitivity-g level at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 7. y axis zero-g level at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 8. y axis sensitivity-g level at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 9. z axis zero-g level at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 10. z axis sensitivity-g level at 3.3 v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 11. x axis zero-g level change vs. temperature at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 12. x axis sensitivity-g change vs. temperature at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 13. y axis zero-g level change vs. temperature at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 14. y axis sensitivity-g change vs. temperature at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 15. z axis zero-g level change vs. temperature at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 16. z axis sensitivity-g change vs. temperature at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 17. current consumption in normal mode at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 18. current consumption in power-down mode at 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 19. lga-14: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
list of tables LIS302SG 4/19 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. mechanical characteristics @ vdd =3.3 v, t = 25 c unless otherwise noted . . . . . . . . . . . 7 table 4. electrical characteristics @ vdd =3.3 v, t=25 c unless otherwise noted. . . . . . . . . . . . . . 8 table 5. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 6. filter capacitor selection, c load (x,y,z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 7. mux i/o table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 8. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
LIS302SG block diagram and pin description 5/19 1 block diagram and pin description figure 1. block diagram 1.1 pin description figure 2. pin connection s/h s/h routx routz reference trimming circuit clock s/h routy charge amplifier demux voutx voutz vouty aux_in vout s1 s0 mux y+ z+ y- z- x+ x- a self-test mux (top view) directions of detectable accelerations (bottom view) reserved reserved s0 s1 st pd vouty voutz gnd vout aux_in vdd voutx reserved y 1 x z 13 1 6 8
block diagram and pin description LIS302SG 6/19 table 2. pin description pin # pin name function 1 reserved connect to vdd 2 reserved connect to vdd 3 s0 mux selector 0 (connect to vdd or to gnd) 4 s1 mux selector 1 (connect to vdd or to gnd) 5 st self-test (logic 0: normal mode; logic 1: self-test) 6 pd power-down (logic 0: normal mode; logic 1: power-down mode) 7 voutx output voltage x channel 8 vouty output voltage y channel 9 voutz output voltage z channel 10 gnd 0v supply 11 vout multiplexer output 12 aux_in auxiliary input 13 vdd power supply 14 reserved connect to vdd
LIS302SG mechanical and electrical specifications 7/19 2 mechanical and electrical specifications 2.1 mechanical characteristics table 3. mechanical characteristics @ vdd =3.3 v, t = 25 c unless otherwise noted (1) symbol parameter test condition min. typ. (2) max. unit ar acceleration range (3) 2.0 g so sensitivity (4) 0.145*vdd ?5% 0.145*vdd 0.145*vdd + 5% v/g sodr sensitivity change vs. temperature delta from +25 c 0.01 %/c voff zero-g level (4) t = 25 c vdd/2-6% vdd/2 vdd/2+6% v offdr zero-g level change vs temperature delta from +25 c 0.5 mg/c nl non linearity (5) best fit straight line 0.5 % fs crossax cross-axis (6) 2 % an acceleration noise density vdd=3.3 v 200 g/ vt self-test output voltage change (7),(8) t = 25 c vdd=3.3 v x axis +95 +200 mv t = 25 c vdd=3.3 v y axis +95 +200 mv t = 25 c vdd=3.3 v z axis +95 +200 mv fres sensing element resonant frequency (9) all axes 2.0 khz top operating temperature range -40 +85 c wh product weight 30 mgram 1. the product is factory calibrated at 3.3 v. the operational power supply range is specified in table 4 . since the device is ratiometric voff, so and vt paramet ers will vary with supply voltage. 2. typical specificat ions are not guaranteed 3. guaranteed by wafer level test and measurement of initial offset and sensitivity 4. zero-g level and sensitivity are ratiometric to supply voltage 5. guaranteed by design 6. contribution to the measuring output of an inclination/acceleration along any perpendicular axis 7. ?self-test output voltage change? is defined as vout (vst=logic 1) -vout (vst=logic 0) 8. ?self-test output voltage change? varies cubically with supply voltage 9. minimum resonance frequency fres=2 .0 khz. sensor bandwidth=1/(2* *32k ? *cload), with cload>2.5 nf hz
mechanical and electrical specifications LIS302SG 8/19 2.2 electrical characteristics table 4. electrical characteristics @ vdd =3.3 v, t=25 c unless otherwise noted (1) 1. the product is factory calibrated at 3.3 v. symbol parameter test condition min. typ. (2) 2. typical specificat ions are not guaranteed max. unit vdd supply voltage 3.0 3.3 3.6 v idd supply current mean value pd pin connected to gnd 0.65 ma iddpdn supply current in power-down mode pd pin connected to vdd 1 a vst self-test input logic 0 level at vdd=3.3 v 0 0.2*vdd v logic 1 level at vdd=3.3 v 0.8*vdd vdd v rout output impedance of voutx, vouty, voutz 32 k ? cload capacitive load drive for voutx, vouty, voutz (3) 3. minimum resonance frequency fres=2 .0 khz. device bandwidth=1/(2* *32k ? *cload), with cload>2.5 nf 2.5 nf vs0 s0 input logic 0 level at vdd=3.3 v 0 0.2*vdd v logic 1 level at vdd=3.3 v 0.8*vdd vdd v vs1 s1 input logic 0 level at vdd=3.3 v 0 0.2*vdd v logic 1 level at vdd=3.3 v 0.8*vdd vdd v rmux series resistance of multiplexer input vs. vout 1 k ? cloadmux capacitive load drive for multiplexed output vout 10 pf to n turn-on time at exit from power-down mode cload in f 160*cload+0.3 ms to p operating temperature range -40 +85 c
LIS302SG mechanical and electrical specifications 9/19 2.3 absolute maximum ratings stresses above those listed as ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. table 5. absolute maximum ratings symbol ratings maximum value unit vdd supply voltage -0.3 to 6 v vin input voltage on any control pin (pd, st, s0, s1) -0.3 to vdd +0.3 v v aux_in aux_in input voltage -0.3 to vdd +0.3 v a pow acceleration (any axis, powered, vdd=3.3 v) 3000 g for 0.5 ms 10000 g for 0.1 ms a unp acceleration (any axis, not powered) 3000 g for 0.5 ms 10000 g for 0.1 ms t stg storage temperature range -40 to +150 c esd electrostatic discharge protection 2 (hbm) kv 1.5 (cdm) kv 200 (mm) v this is a mechanical shock sensitive device, improper handling can cause permanent damages to the part this is an esd sensitive device, improper handling can cause permanent damages to the part
mechanical and electrical specifications LIS302SG 10/19 2.4 terminology sensitivity describes the gain of the sensor and can be determined by applying 1 g acceleration to it. as the sensor can measur e dc accelerations this can be done easily by pointing the axis of interest towards the center of the earth, note the output value, rotate the sensor by 180 degrees (point to the sky) and note the output value again thus applying 1 g acceleration to the sensor. subtracting the larger output value from the smaller one, and dividing the result by 2, will give the actual s ensitivity of the sensor. this value changes very little over temperature (see sensitivity change vs. temperature) and also very little over time. the sensitivity tolerance describes the range of sensitivities of a large population of sensors. zero-g level describes the actual output signal if there is no acceleration present. a sensor in a steady state on a horizontal surface will me asure 0 g in x axis and 0 g in y axis whereas the z axis will measure 1 g. the output is ideally for a 3.3 v po wered sensor vdd/2 = 1650 mv. a deviation from ideal 0-g level (165 0 mv in this case) is called zero-g offset. offset of precise mems sensors is to some extend a result of stress to the sensor and therefore the offset can slightly change afte r mounting the sensor onto a printed circuit board or exposing it to extensive mechanical st ress. offset changes little over temperature - see ?zero-g level change vs. temperature? - the zero-g level of an individual sensor is very stable over lifetime. the zero-g level tolerance describes the range of zero-g levels of a population of sensors. self-test allows to check the sensor functionality without moving it. the self-test function is off when the st pin is connected to gnd. when the st pin is tied at vdd an actuation force is applied to the sensor, simulating a definite input acceleration. in this case the sensor outputs will exhibit a voltage change in their dc levels. when st is activated, the device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic test-f orce. if the output signals change within the amplitude specified inside ta bl e 3 , then the sensor is working properly and the parameters of the interface chip are within the defined specification. output impedance describes the resistor inside the output stage of each channel. this resistor is part of a filter consisting of an external capacitor of at least 2.5 nf and the internal resistor. due to the resistor level, only small inexpensive external capacitors are needed to generate low corner frequencies. when interfacing with an adc it is important to use high input impedance input circuitries to avoid measurement errors. note that the minimum load capacitance forms a corner frequency close to the resonance frequency of the sensor. in general the smallest possible bandwidth for a pa rticular application should be chosen to get the best results.
LIS302SG functionality 11/19 3 functionality the LIS302SG is a ?piccolo? low-power, analog output three-axis linear accelerometer packaged in a lga package. the complete device includes a sensing element and an ic interface able to take the information from the sensing element and to provide an analog signal to the external world. the sensor provides the three accelerations and one multiplexed analog output. 3.1 sensing element a proprietary process is used to create a surface micro-machined accelerometer. the technology allows to carry out suspended s ilicon structures which are attached to the substrate in a few points called anchors and are free to move in the direction of the sensed acceleration. to be compatible with the traditional packaging techniques a cap is placed on top of the sensing element to avoid blocking the moving parts during the moulding phase of the plastic encapsulation. when an acceleration is applied to the sensor the proof mass displaces from its nominal position, causing an imbalance in the capacit ive half-bridge. this imbalance is measured using charge integration in response to a voltage pulse applied to the sense capacitor. at steady state the nominal value of the capacitors are few pf and when an acceleration is applied the maximum variation of the capacitive load is in the ff range. 3.2 ic interface the complete signal processing uses a fully differential structure, while the final stage converts the differential signal into a single-ended one to be compatible with the external world. the first stage is a low-noise capacitive amplifier that implements a correlated double sampling (cds) at its output to cancel the offset and the 1/f noise. the produced signal is then sent to three different s&hs, one for each channel, and made available to the outside. the device provides an embedded multiplexer to allow the redirection of either the analog output signals voutx, vouty, and voutz or of an auxiliary input signal onto a single pin for operation with a single channel a/d converter. all the analog parameters (output offset voltage and sensitivity) are ratiometric to the voltage supply. increasing or de creasing the voltage supply, t he sensitivity and the offset will increase or decrease linearly. the feature provides the cancellation of the error related to the voltage supply along an analog to digital conversion chain. 3.3 factory calibration the ic interface is factory calibrated for sensitivity (so) and zero-g level (voff). the trimming values are stored inside the device in a non volatile structure. any time the device is turned on, the trimming parameters are downloaded into the registers to be employed during the normal operation. this allows the user to employ the device without further calibration.
application hints LIS302SG 12/19 4 application hints figure 3. LIS302SG electrical connection power supply decoupling capacitors (100 nf ceramic or polyester + 10 f aluminum) should be placed as near as possible to the device (common design practice). the LIS302SG allows to band limit voutx, vouty and voutz through the use of external capacitors. the recommended frequency range spans from dc up to 2.0 khz. capacitors must be added at output pins to implement low-pass filtering for antialiasing and noise reduction, even if the only multiplexed output ( vout ) is used. the equation for the cut-off frequency ( f t ) of the external filters is: taking into account that the internal filtering resistor (r out ) has a nominal value equal to 32 k ? , the equation for the external filter cut-off frequency may be simplified as follows: the tolerance of the internal resistor can vary typically of 20% within its nominal value of 32 k ? ; thus the cut-off frequency will vary accordin gly. a minimum capacitance of 2.5 nf for c load (x, y, z) is required in any case. an external capacitor can be added to the vout pin. values below 10 pf are recommended. directions of detectable accelerations y 1 x z digital signals vout x LIS302SG vout y cload y cload x (top view) optional optional 1 st s1 s0 pd optional cload z 6 8 13 aux in 100nf 10 f gnd gnd vdd vout gnd vdd pin 1 indicator optional analog signals cloadmux vout z f t 1 2 r out c load xyz ,, () ?? ------------------------------------------------------------------------ - = f t 5 f c load xyz ,, () -------------------------------------- - hz [] =
LIS302SG application hints 13/19 4.1 soldering information the lga package is compliant with the ecopack ? , rohs and ?green? standard. it is qualified for soldering heat resist ance according to jedec j-std-020c. leave ?pin 1 indicator? unconnected during soldering. land pattern and soldering recommendations are available at www.st.com/mems . 4.2 output response vs. orientation figure 4. output response vs. orientation figure 4 refers to LIS302SG powered at 3.3 v. table 6. filter capacitor selection, c load (x,y,z) cut-off frequency capacitor value 1 hz 5 f 10 hz 0.5 f 20 hz 250 nf 50 hz 100 nf 100 hz 50 nf 200 hz 25 nf 500 hz 10 nf table 7. mux i/o table s1 pin s0 pin mux status 0 0 vout = voutx 0 1 vout = vouty 1 0 vout = voutz 11 vout = aux_in earth?s surface x=1.65v (0g) y=1.65v (0g) z=2.13v (+1g) x=1.65v (0g) y=1.65v (0g) z=1.17v (-1g) x=1.17v (-1g) y=1.65v (0g) x=2.13v (+1g) y=1.65v (0g) x=1.65v (0g) y=1.17v (-1g) x=1.65v (0g) y=2.13v (+1g) z=1.65v (0g) z=1.65v (0g) z=1.65v (0g) z=1.65v (0g) to p bottom to p bottom
typical performance characteristics LIS302SG 14/19 5 typical performance characteristics 5.1 mechanical characteristics at 25c figure 5. x axis zero-g level at 3.3 v figure 6. x axis sensitivity-g level at 3.3 v figure 7. y axis zero-g level at 3.3 v figure 8. y axis sensitivity-g level at 3.3 v figure 9. z axis zero-g level at 3.3 v figure 10. z axis sensitivity-g level at 3.3 v ?250 ?200 ?150 ?100 ?50 0 50 100 150 200 250 0 5 10 15 20 25 zero?g level offset [mg] percent of parts [%] 0.43 0.44 0.45 0.46 0.47 0.48 0.49 0.5 0.51 0.52 0 5 10 15 20 25 sensitivity [v/g] percent of parts [%] ?250 ?200 ?150 ?100 ?50 0 50 100 150 200 250 0 5 10 15 20 25 30 zero?g level offset [mg] percent of parts [%] 0.43 0.44 0.45 0.46 0.47 0.48 0.49 0.5 0.51 0.52 0 5 10 15 20 25 sensitivity [v/g] percent of parts [%] ?250 ?200 ?150 ?100 ?50 0 50 100 150 200 250 0 5 10 15 20 25 zero?g level offset [mg] percent of parts [%] 0.43 0.44 0.45 0.46 0.47 0.48 0.49 0.5 0.51 0.52 0 5 10 15 20 25 30 sensitivity [v/g] percent of parts [%]
LIS302SG typical performance characteristics 15/19 5.2 mechanical characteristics de rived from measurement in the -40 c to +85 c temperature range figure 11. x axis zero-g level change vs. temperature at 3.3 v figure 12. x axis sensitivity-g change vs. temperature at 3.3 v figure 13. y axis zero-g level change vs. temperature at 3.3 v figure 14. y axis sensitivity-g change vs. temperature at 3.3 v figure 15. z axis zero-g level change vs. temperature at 3.3 v figure 16. z axis sensitivity-g change vs. temperature at 3.3 v ?6 ?4 ?2 0 2 4 6 0 5 10 15 20 25 30 35 40 45 50 0?g level drift (mg/ o c) percent of parts (%) ?0.05 ?0.04 ?0.03 ?0.02 ?0.01 0 0.01 0.02 0.03 0.04 0.05 0 5 10 15 20 25 30 sensitivity drift (%/ o c) percent of parts (%) ?6 ?4 ?2 0 2 4 6 0 10 20 30 40 50 60 0?g level drift (mg/ o c) percent of parts (%) ?0.05 ?0.04 ?0.03 ?0.02 ?0.01 0 0.01 0.02 0.03 0.04 0.05 0 5 10 15 20 25 30 35 sensitivity drift (%/ o c) percent of parts (%) ?6 ?4 ?2 0 2 4 6 0 5 10 15 20 25 30 35 40 45 50 0?g level drift (mg/ o c) percent of parts (%) ?0.05 ?0.04 ?0.03 ?0.02 ?0.01 0 0.01 0.02 0.03 0.04 0.05 0 5 10 15 20 25 30 35 40 sensitivity drift (%/ o c) percent of parts (%)
typical performance characteristics LIS302SG 16/19 5.3 electro-mechanical ch aracteristics at 25 c figure 17. current consumption in normal mode at 3.3 v figure 18. current consumption in power-down mode at 3.3 v 500 550 600 650 700 750 800 850 900 0 5 10 15 20 25 current consumption [ua] percent of parts [%] 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 5 10 15 20 25 current consumption [ua] percent of parts [%]
LIS302SG package information 17/19 6 package information in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack ? is an st trademark. ecopack ? specifications are available at: www.st.com . figure 19. lga-14: mechanical data and package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a1 0.920 1.000 0.0 3 62 0.0 3 94 a2 0.700 0.0275 a 3 0.1 8 0 0.220 0.260 0.0071 0.00 8 7 0.0102 d1 2. 8 50 3 .000 3 .150 0.1122 0.11 8 1 0.1240 e1 4. 8 50 5.000 5.150 0.1909 0.196 8 0.2027 e0. 8 00 0.0 3 15 d0. 3 00 0.011 8 l1 4.000 0.1575 n1. 3 60 0.05 3 5 n1 1.200 0.0472 p1 0.965 0.975 0.9 8 50.0 38 0 0.0 38 40.0 38 6 p2 0.640 0.650 0.660 0.0252 0.0256 0.0260 t1 0.750 0. 8 00 0. 8 50 0.0295 0.0 3 15 0.0 33 5 t2 0.450 0.500 0.550 0.0177 0.0197 0.0217 r 1.200 1.600 0.0472 0.06 3 0 h 0.150 0.0059 k 0.050 0.0020 i 0.100 0.00 3 9 s 0.100 0.00 3 9 lga-14 ( 3 x5x0.92mm) pitch 0. 8 mm l a nd g rid a rr a y packa g e 777 3 5 8 7 c
revision history LIS302SG 18/19 7 revision history table 8. document revision history date revision changes 05-mar-2008 1 initial release
LIS302SG 19/19 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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